Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
inductance de boîtier — korpuso induktyvumas statusas T sritis radioelektronika atitikmenys: angl. package inductance vok. Gehäuseinduktivität, f rus. индуктивность корпуса, f pranc. inductance de boîtier, f … Radioelektronikos terminų žodynas
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Transient voltage suppression diode — A transient voltage suppression (TVS) diode is an electronic component used to protect sensitive electronics from voltage spikes induced on connected wires. It is also commonly referred to as a transorb, after the brand name TranZorb registered… … Wikipedia
Gehäuseinduktivität — korpuso induktyvumas statusas T sritis radioelektronika atitikmenys: angl. package inductance vok. Gehäuseinduktivität, f rus. индуктивность корпуса, f pranc. inductance de boîtier, f … Radioelektronikos terminų žodynas
korpuso induktyvumas — statusas T sritis radioelektronika atitikmenys: angl. package inductance vok. Gehäuseinduktivität, f rus. индуктивность корпуса, f pranc. inductance de boîtier, f … Radioelektronikos terminų žodynas
индуктивность корпуса — korpuso induktyvumas statusas T sritis radioelektronika atitikmenys: angl. package inductance vok. Gehäuseinduktivität, f rus. индуктивность корпуса, f pranc. inductance de boîtier, f … Radioelektronikos terminų žodynas
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Power MOSFET — A Power MOSFET is a specific type of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to handle large power. Compared to the other power semiconductor devices (IGBT, Thyristor...), its main advantages are high commutation speed … Wikipedia
Capacitor — This article is about the electronic component. For the physical phenomenon, see capacitance. For an overview of various kinds of capacitors, see types of capacitor. Capacitor Modern capacitors, by a cm ruler Type Passive … Wikipedia
Power network design (IC) — In integrated circuits, electrical power is distributed to the components of the chip over a network of conductors on the chip. Power network design (IC) includes the analysis and design of such networks. As in all engineering, this involves… … Wikipedia
